기판세정방법및장치,기판세정/건조방법및장치

Abstract

본 발명의 기판 세척 방법은, (a) 이동가능하게 설치된 보트를 갖는 처리조내에 세척액을 도입하여 처리조내를 세척액으로 채우고, (b) 복수의 기판을 쳐크 부재에 의해 실질적으로 동일한 피치간격으로 한꺼번에 집고, (c) 쳐크 부재와 함께 기판을 상기 처리조내의 세척액에 담그고, (d) 처리조의 상부 영역에서 쳐크 부재로부터 보트로 기판을 이동 배치하고, (e) 세척액중에서 보트와 함께 기판을 이동시켜 기판을 처리조의 하부 영역에 위치시키고, (f) 처리조의 상부 영역으로부터 세척액을 배출하며, (g) 처리조의 하부 영역에 세척액을 공급하여 세척액을 처리조로부터 오버플로우시킨다.
A method of washing substrates comprises the steps of (a) introducing a washing solution (101) into a processing vessel (10) having a wafer boat (30) movably mounted therein to fill the vessel (10) with the washing solution (101), (b) allowing a plurality of wafers (W) to be held collectively by a chuck (20a) such that the wafers (W) held by the chuck (20a) are arranged at substantially an equal pitch, (c) dipping the wafers (W) together with the chuck (20a) in the washing solution (101) within the processing vessel (10), (d) transferring the wafers (W) from the chuck (20a) onto the wafer boat in an upper region (12) of the processing vessel (10), (e) moving the wafers (W) together with the wafer boat (30) within the washing solution (101) to allow the substrates to be positioned in a lower region (11) of the processing vessel (10), (f) discharging the washing solution (101) from the upper region (12) of the processing vessel (10), (g) supplying a fresh washing solution (101) into the lower region (11) of the processing vessel (10) so as to cause the washing solution (101) within the processing vessel (10) to overflow the processing vessel (10), (h) taking the washed wafers (W) out of the processing vessel (10). <IMAGE> <IMAGE>

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